Integration of shallow trench isolation and through-substrate vias into integrated circuit designs

ABSTRACT

A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No. 12/969,852filed on Dec. 16, 2010 to Bachman, et al. entitled “INTEGRATION OFSHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATEDCIRCUIT DESIGNS,” currently allowed, which, in turn, is related to U.S.patent application Ser. No. 12/969,836 filed on Dec. 16, 2010 toBachman, et al. entitled “METHOD OF FABRICATION OF THROUGH-SUBSTRATEVIAS,” currently pending; both of which are commonly assigned with thepresent invention and fully incorporated by reference herein in theirentirety.

TECHNICAL FIELD OF THE INVENTION

This application is directed, in general to integrated circuits andtheir manufacture, and in particular, to integrated circuits thatinclude shallow trench isolation and through-substrate via structures.

BACKGROUND OF THE INVENTION

Typical semiconductor integrated circuit (IC) designs require that somecircuit components be electrically isolated from other circuitcomponents within the design to avoid deleterious electricalinteractions such as shorting or cross-talk. One method of isolatingcircuit components uses shallow trench isolation (STI) to separate theseregions. Also in some IC designs, such as three-dimensional IC designs,through-substrate vias (TSV) are created connecting front-side circuitryto the substrate's back-side.

SUMMARY OF THE INVENTION

The present disclosure provides, in one embodiment, a method ofmanufacturing an integrated circuit. The method comprises providing asubstrate having a first side and a second opposite side, forming ashallow trench isolation opening in the first side of the substrate andforming a partial through-substrate via opening in the first side of thesubstrate. The method also comprises extending the partialthrough-substrate-via opening, wherein the extended partialthrough-substrate-via opening is deeper into the substrate than theshallow trench isolation opening. The method further comprises fillingthe shallow trench isolation opening with a first solid material andfilling the extended partial through-substrate via opening with a secondsolid material. Neither the shallow trench isolation opening, thepartial through-substrate-via opening, nor the extended partialthrough-substrate-via opening penetrate an outer surface of the secondside of the substrate. At least either: the shallow trench isolationopening and the partial through-substrate-via opening are formedsimultaneously, or, the shallow trench isolation opening and theextended partial through-substrate-via opening are filledsimultaneously.

Another embodiment is another method of manufacturing an integratedcircuit. The method comprises providing a substrate having a first sideand a second opposite side. The method comprises forming a shallowtrench isolation opening in the first side of the substrate. The methodcomprises forming a partial through-substrate via opening in the firstside of the substrate, wherein the opening defining the shallow trenchisolation structure and the opening defining the through-substrate viahave a substantially same width-to-depth aspect ratio. The methodcomprises extending the partial through-substrate-via opening, whereinthe extended partial through-substrate-via opening is deeper into thesubstrate than the shallow trench isolation opening. The methodcomprises filling the shallow trench isolation opening with a firstsolid material. The method comprises filling the extended partialthrough-substrate via opening with a second solid material. Neither theshallow trench isolation opening, the partial through-substrate-viaopening, nor the extended partial through-substrate via penetrate anouter surface of the second side of the substrate. At least either: theshallow trench isolation opening and the partial through-substrate-viaopening are formed simultaneously, or, the shallow trench isolationopening and the extended partial through-substrate-via opening arefilled simultaneously.

Still another embodiment of the disclosure is another method ofmanufacturing integrated circuit. The method comprises providing asubstrate having a first side and a second opposite side. The methodcomprises forming a shallow trench isolation opening in the first sideof the substrate. The method comprises forming a partialthrough-substrate via opening in the first side of the substrate. Themethod comprises extending the partial through-substrate-via opening,wherein the extended partial through-substrate-via opening is deeperinto the substrate than the shallow trench isolation opening. The methodcomprises filling the shallow trench isolation opening with a firstsolid material. One end of the first material is buried inside thesubstrate and an opposite end of the first material is located at asurface of the first side of the substrate, and, the first sold materialincludes a passivation layer and a diffusion barrier layer on sidewallsof the opening defining the shallow trench isolation structure and onsidewalls of the opening defining the through-substrate via. The methodcomprises filling the extended partial through-substrate via openingwith a second solid material. Neither the shallow trench isolationopening, the partial through-substrate-via opening, nor the extendedpartial through-substrate via penetrate an outer surface of the secondside of the substrate. At least either: the shallow trench isolationopening and the partial through-substrate-via opening are formedsimultaneously, or, the shallow trench isolation opening and theextended partial through-substrate-via opening are filledsimultaneously.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, reference isnow made to the following descriptions taken in conjunction with theaccompanying drawings, in which:

FIG. 1 presents a flow diagram illustrating selective steps in anexample embodiment of a method of manufacturing an integrated circuit ofthe disclosure;

FIGS. 2-7 presents cross-sectional views of selected steps in an examplemethod of manufacturing an example integrated circuit of the disclosurein accordance with the example method presented in FIG. 1; and

FIG. 8 presents an example integrated circuit of the disclosure.

DETAILED DESCRIPTION

For the purposes of the present disclosure, the term, “or,” as usedherein, refers to a non-exclusive or, unless otherwise indicated.

Embodiments of the present disclosure improve the efficiency of ICdesigns. At least one of forming the STI opening and forming a portionof the TSV opening, or, filling STI and TSV openings, are performedsimultaneously as a single step. The simultaneous processing of one orboth of these steps in the IC's fabrication can permit one or more ofcommon patterning, etching, deposition or other formation processesprior to dielectric and metal stack processing. This, in turn, canreduce the cost, the time and resource utilization, by reducing thenumber of separate processing steps or tools needed for the IC'sfabrication, as compared to traditional methods.

One embodiment of the disclosure is a method of manufacturing an IC.FIG. 1 presents a flow diagram illustrating selective steps in anexample embodiment of a method 100 of manufacture. FIGS. 2-8 presentcross-sectional views of selected steps in an example method ofmanufacturing an example integrated circuit 200 of the disclosure, inaccordance with the example method 100 presented in FIG. 1.

With continuing reference to FIG. 1 throughout, as shown FIG. 2, themethod 100 includes a step 105 of providing a substrate 205 having afirst side 210 and a second opposite side 215. Example embodiments ofthe substrate 205 include a wafer substrate composed of silicon or othersemiconductor materials, substrate dies, package substrates, orinterposer substrates. Some embodiments of the substrate 205 can havemultiple layers to facilitate the efficient fabrication of various ICcomponents. For instance, some embodiments of the substrate 205 includea constituent layer 220. For example, some embodiments of theconstituent layer 220 can include a mono-crystalline layer composed ofsilicon such as epitaxial-formed crystalline silicon. In otherembodiments, the constituent layer 220 can include asilicon-on-insulator layer, or polysilicon layer or other materiallayers well known to those skilled in the art. In some cases, theconstituent layer 220 can have a thickness 222 in a range from 10 to 20microns. One of ordinary skill would appreciate that other types ofsubstrates and constituent layers could be used, if desired.

As shown in FIG. 3A, the method 100 includes a step 110 of forming a STIopening 302 in the first side 210 of the substrate 205, and, a step 115of forming a partial TSV opening 304 in the first side 210 of thesubstrate 205. One of ordinary skill in the art would be familiar withthe procedures to pattern (e.g., by conventional photolithography andmasking processes) and to etch (e.g., reactive ion etching or otherconventional etching processes) the first side 210 of the substrate 205to form the openings 302, 304 in accordance with steps 110, 115.

As shown in FIG. 3B, the method 100 includes a step 117 of extending thepartial TSV opening 304 (FIG. 3A), wherein the extended partial TSVopening 305 is deeper into the substrate 205 than the STI opening 302.One of ordinary skill in the art would be familiar with the proceduresto additionally pattern and to etch the first side 210 of the substrate205 to form the extended partial TSV opening 305.

As also illustrated in FIGS. 3A-3B, neither the STI opening 302, thepartial TSV opening 304, nor the extended partial TSV opening 305penetrate an outer surface 306 of the second side 215 of the substrate205. One of ordinary skill in the art would be familiar with theprocedures to achieve such a configuration of the openings 302, 304, 305at different steps in the method 100.

The method 100 includes a step 120 of filling the STI opening 302 with afirst solid material 307, and step 125 of filling the extended partialTSV opening 305 with a second solid material 310.

At least either: 1) the STI opening 302 and the partial TSV opening 304are formed simultaneously (i.e., steps 110, 115 are performedsimultaneously as a single step 130), or, 2) the STI opening 302 and theextended partial TSV opening 305 are filled simultaneously (i.e., step120, 125 are performed simultaneously as a single step 135).

There are gains in time, cost or resource efficiencies by either, orboth, simultaneously forming the openings 302, 304 (step 130) orsimultaneously filling the openings 302, 305 (step 135). For instance,it is sometimes beneficial to use the same etching tool and same etchingprocess to simultaneously form the two different openings 302, 304.Similarly, it is sometimes beneficial to use the same deposition tool orother formation tool and the same deposition process or other formationprocess to simultaneously fill the two different types of openings 302,305 with a same solid material.

In some cases, however, it can be desirable to use different processesto form the openings 302, 304, or, to fill the openings 302, 305 usingdifferent processes or to fill using different solid materials.

For instance, in some embodiments, after simultaneously forming the STIopening 302 and the partial TSV opening 304 (step 130) the STI opening302 is filled from the first side 210 of the substrate 205 with a firstsolid material 307 that includes a insulating material, and, theextended partial TSV opening 305 is filled from the first side 210 ofthe substrate 205 with a second solid material 310 that includes adifferent insulating material or an electrically conductive material.

In other embodiments, however, the STI opening 302 and the partial TSVopening 304 are simultaneously formed in step 130, and then, the STIopening 302 and the extended partial TSV opening 305 are simultaneouslyfilled in step 135. In such cases, the first solid material 307 and thesecond solid material 310 can include a similar material or identicalmaterial.

In still other embodiments it is desirable to use two differentprocesses (e.g., step 110 and step 115), to form the STI opening 302 andpartial TSV opening 304, e.g., such that the opening 302 have adifferent aspect ratio as compared to the partial TSV opening 304 or theextended partial TSV opening 305. For instance, the width 320 to depth325 ratio of the extended partial TSV opening 305 can be different(e.g., at least about 10 percent or more different in some embodiments)than the width 330 to depth 335 ratio of the STI opening 302. Oneskilled in the art would recognize that using different processes toform the openings 302, 304, 305 does not preclude using a single samestep 135 to fill the openings 302, 305, however.

As noted above, in some cases it is desirable to use two differentprocesses (e.g., steps 120, 125) to fill the STI opening 302 and theextended partial TSV opening 305 with different solid materials 307,310, respectively. For example, in some embodiments, the step 120 tofill the STI opening 302 can include a physical vapor deposition processor chemical vapor deposition process or other processes to fill the STIopening 302 with one or more type of insulating material 307 (e.g.,multiple layers of different insulating materials, in some cases). Insome embodiments, the step 125 to fill the extended partial TSV opening305 can include a physical vapor deposition process (e.g., sputtering)and electrochemical deposition process or other forming processes tofill the opening 305 with a electrically conductive material 310. Oneskilled in the art would recognize that using different processes (steps120, 125) to fill the openings 302, 305 does not preclude using a samesingle step 130 to form the openings 302, 304, however.

FIG. 3B shows an embodiment of the method 100 when the STI opening 302and the extended partial TSV opening 305 are simultaneously filled (step135). In such cases of simultaneous filling the first and second solidmaterials 307, 310 are preferably insulating materials. In some cases,e.g., the step 120 of filling the STI opening 302 includes filling theopening 305 with an insulating material 310 that includes a passivationlayer 312, and diffusion barrier layer 314. The step 125 of filling theextended partial TSV opening 305 can be the same as step 120 (i.e.,simultaneous filling step 135). One or both of the layers 312, 314 canbe on the interior walls (e.g., coating the entire sidewalls 316 andfloor 318 in some cases) of the STI opening 302 or the extended partialTSV opening 305. In some cases, the step 125 of filling the extendedpartial TSV opening 305 also includes filling the opening 305 with aninsulating material 310 that includes the diffusion barrier layer 314,e.g., that can coat the interior walls (e.g., the sidewalls 316 andfloor 318) of the opening 305. In such cases, one again, the step 120 offilling the STI opening 302 can be the same as step 125 (i.e., asimultaneous step 135) and therefore the diffusion barrier layer 314,e.g., coats the interior walls of the STI opening 302.

As further illustrated in FIG. 4, in some cases the step 125 of fillingthe extended partial TSV opening 305 can include filling the opening 305with an insulating material 310 that includes an insulating plug 410.When the step 120 of filling STI opening 302 also includes filling theopening 302 with an insulating plug 410, then both the STI opening 302and extended partial TSV opening 305 can be filled with a sameinsulating solid material (e.g., the first and second materials 307, 310are the same).

As illustrated in FIG. 4, in some cases, the STI opening 302 andextended partial TSV opening 305 are both filled with an insulatingmaterial (e.g., the first and second solid materials 307, 310) thatincludes one or more of a passivation layer 312 of silicon oxide thatcoats the interior walls 316, 318 of the TSV opening and STI opening302; a diffusion barrier layer 314 of silicon nitride on the passivationlayer 312 and an insulating plug 410 of dielectric material (e.g.,silica glass, in some cases), contacting the diffusion barrier layer andsubstantially filling the entire depths 335, 325 (FIG. 3), respectively,of the STI opening 302 and extended partial TSV opening 305.

Some embodiments of the method 100 can further include a step 140 offorming at least one active or passive electronic component 420 (FIG. 4)on the first side 210 of the substrate 205. One of ordinary skill in theart would be familiar with the procedures to fabricate passivecomponents, such as resistors or inductors, or active components, suchas memory circuit components (e.g., SRAM or DRAM memory) or logiccircuit components (e.g., CMOS or bi-CMOS logic integrated circuits).

As further explained in Bachman et al., in some case, it is preferableto form the active or passive component 420 before filling the extendedpartial TSV opening 305 with an electrically conductive material if thisavoids exposing the electrically conductive material in the opening 305to subsequent high temperature processes (e.g., temperature of about200° C. or higher in some embodiments).

In some embodiments, the active or passive electronic component 420 iselectrically isolated from an adjacent active or passive electroniccomponent 425 by at least one STI opening 302 being located between thetwo components 420, 425. In some embodiments, the active or passiveelectronic component 420 is electrically isolated from an adjacentextended partial TSV opening 305, by at least one STI opening 302 beinglocated between the active or passive electronic component 420 and theadjacent TSV opening 305. Forming the adjacent active or passiveelectronic components 420, 425 so that they are separated from eachother, or from an adjacent TSV, by a STI structure helps reducecross-talk and other electrical interferences between these components.

Some embodiments of the method 100 can further include a step 145 ofcovering the extended partial TSV opening 305 on the first side with anelectrically conductive layer 430. One of ordinary skill in the artwould be familiar with the procedures to form the electricallyconductive layer 430 on a substrate 205. As a non-limiting example, step145 can include forming (e.g., sputtering) a seed layer of a metal(e.g., tungsten, gold or copper) which in some cases is followed byelectrochemical formation of the same metal (e.g., copper). In somecases, as illustrated in FIG. 4, as part of forming the electricallyconductive layer 430, a barrier layer 435 (e.g., a silicon nitridelayer) is first formed and then patterned so as to cover the extendedpartial TSV opening 305. In some embodiments, the first-side extendedpartial TSV opening 305 is covered with the electrically conductivelayer 430 in step 145 before the solid material 310 (e.g., an insulatingmaterial) in the opening 305 is removed, or, before the opening 305 isfilled with an electrically conductive material. This ordering of stepsmay be advantageous, e.g., when step 145 includes exposing the substrate205 to high temperature processes.

Some embodiments of the method 100 further include a step 150 of forminginterconnect structures 440 (e.g., metal lines, vias, and landing pads)on the first side 210 of the substrate 205. One of ordinary skill in theart would be familiar with the procedures to form the interconnectstructures 440. For instance, as part of step 150, one or moreinterlayer dielectric layers 450 can be formed on the first side 210 tosupport and electrically insulate the interconnect structures 440.

In some embodiments, at least one of the interconnect structures 440contacts an electrically conductive layer 430 covering a first-sideextended partial TSV opening 305, and, also contacts an active orpassive component 420 on the substrate 205. That is, the interconnectstructure 440 is configured to electrically couple the active or passivecomponent 420 to the TSV structure through the electrically conductivelayer 430. In other embodiments, however, the TSV or its coveringelectrically conductive layer 430 may not be coupled to any of theactive or passive component 420 on the substrate 205 and may simply passthrough the substrate 205.

In some embodiments the interconnect structures 440 are formed in step150 before the material 310 (e.g., an insulating material) in theopening 305 is removed, or, before the opening 305 is filled with aconductive material. This ordering of steps, e.g., may be advantageouswhen step 150 includes exposing the substrate 205 to high temperatureprocesses.

Some embodiments of the method 100 can also include a step 155 ofremoving a portion of the substrate (e.g., a substrate layer portion460, FIG. 4) from the second side 215 of the substrate 205 such that theextended partial TSV opening 305 is exposed on the second side 215. Forinstance, FIG. 5 shows the IC 200 after performing chemical mechanicalpolishing (CMP) to planarize the substrate's second side surface 306until the extended partial TSV opening 305 is exposed on the second side215. One skilled in the art would appreciate, however, that other typesof substrate removal procedures (e.g., wet and dry etching) could beused to expose the extended partial TSV opening 305.

As illustrated in FIG. 6, some embodiments of the method 100 furtherinclude a step 160 of removing at least a portion of the solid material310 (e.g., the insulating plug 410, FIG. 5) inside of the extendedpartial TSV opening 305 from the second side 215 of the substrate 205such that a second-side TSV opening 610 extends from the second side 215to the first side 210 of the substrate 205.

In some cases, it is desirable to retain some of the material 310 insideof the second-side TSV opening 610. For instance, having a passivationlayer 312 and barrier layer 314 on sidewalls 316 of the second-side TSVopening 610 can be advantageous when the second side through-via opening610 is to be filled with an electrically conductive material composed ofhighly diffusible metal atoms (e.g., copper atoms). Such metal atoms candetrimentally diffuse from the TSV into the substrate 205, includingthose regions of the substrate 205 where the active and passivecomponents 420 are located, thereby damaging these components 420.

In some cases, for example, removing at least a portion of the material310 in step 160 can include a dry etch process of the insulating plug410 (FIG. 5) that substantially traverses an entire thickness 615 ofsubstrate 205 the second-side TSV opening 610. In some cases theremoving step 160 can additionally or alternatively include a wet etchprocess (e.g., a hydrofluoric acid etch process) of the insulating plug410 (e.g., a silica glass or other dielectric material) thatsubstantially traverses the entire thickness 615 of substrate 205through the second-side TSV opening 610. In some cases, removing atleast a portion of the solid material 310 in step 160 can also include aplasma etch process configured to remove a barrier layer 435 (e.g.,silicon nitride layer) from an electrically conductive layer 430covering the extended partial TSV opening 305 on the first side 210.That is, removing a portion of the material 310 can include exposing aninterior surface 620 of the electrically conductive layer 430 thatcovers the opening 305. One skilled in the art would be familiar withhow to configure such wet etch and plasma etch processes so as to leavethe passivation layer 312 and barrier layer 314 substantially intact onthe sidewalls 316, if desired.

Some embodiments of the method 100 further include a step 165 of fillingthe second-side TVS opening 610 on the second side of the substrate 205with an electrically conductive material 710 (FIG. 7). In some cases,when there is an electrically conductive layer 430 covering the opening305 on the first side 210, the electrically conductive material 710entirely fills the second-side TSV opening 610 so as to directly contactthe electrically conductive layer 430 (e.g., contacting the interiorsurface 620 of the electrically conductive layer 430).

Non-limiting examples of the types of electrically conductive material710 that could be used includes copper, tungsten, gold, polysilicon,conductive polymers, or similar materials familiar to those skilled inthe art. In some embodiments, to fill a deep opening 610 (e.g., in someembodiments where the substrate thickness 615 (FIG. 6) is about 50microns or greater,) it can be advantageous for the filling step 165 toinclude sputter depositing or other processes for forming a metal seedlayer (e.g., copper) on the interior side walls 615 of the second-sideTSV opening 610 (including on any intervening insulating layers 312, 314on the opening's sidewalls 316) and then electrodepositing or otherwiseforming a bulk metal layer (e.g., copper) to fill the remainder of theopening 610. Other methods to fill the opening 610 in accordance withstep 165 include spin-on processes or other processes familiar to one ofordinary skill in the art. One skilled in the art would also be familiarwith further steps such as CMP to remove excess electrically conductivematerial 710 from the second side 215 surface 306, such that thematerial 710 is only present in the opening 610.

As noted above, in some cases, it is advantageous for the step 165 offilling the second-side TSV opening 610 with the electrically conductivematerial, to be performed after a number of steps (e.g., one or more ofsteps 140-160) have been completed. Based on the present disclosure andof Bachman et al., one of ordinary skill would appreciate that it couldbe advantageous to perform step 165 after other processing steps havebeen done, e.g., to avoid exposing certain conductive materials 710(e.g., copper) located in the second-side TSV opening 610 to hightemperature processes, and thereby avoid causing thermal expansion ofthe material 710, which in turn, can cause cracking or other damage tothe substrate 205.

Another embodiment of the disclosure is an IC. FIG. 8 presents anexample IC 200 of the disclosure. The IC 200 could include any of thefeatures as described above in the context of FIGS. 1-7.

The example IC 200 depicted in FIG. 8 comprises a substrate 205 having afirst side 210 and a second opposite side 215. The IC 200 also comprisesa STI structure 810, wherein one end 812 of the STI structure is buriedinside the substrate 205 and an opposite end 815 of the STI structure810 is located at a surface 817 of the first side 210 of the substrate205. The IC 200 further comprises a TSV 820, wherein one end 822 of theTSV 820 is located at the surface 817 of the first side 210 of thesubstrate 205 and an opposite end 825 of the TSV 820 is located at thesurface 306 of the second side 215 of the substrate 205. A sameinsulating layer in located within the opening 302 defining the STIstructure 810 and within the opening 305 defining the TSV 820. In someembodiments, for example, one or both of a passivation layer 312 ordiffusion barrier layer 314, is located on sidewalls 827 of the opening302 defining the STI structure 810 and on side walls 316 of the opening305 defining the TSV 820.

As further illustrated in FIG. 8, in some embodiments at least one STIstructure 810 is located between the TSV 820 and a passive or activeelectrical component 420 located on the first side 210 of the substrate205. As also illustrated in FIG. 8, in some embodiments, at least oneSTI structure 810 is located between a first passive or activeelectrical component 420 located on the first side 210 of the substrate205 and a second passive or active electrical component 425 located onthe first side 210 of the substrate 205.

Some embodiments of the IC 200 can further include an electricallyconductive layer 430 located on the first side 210 of the substrate 205and covering the TSV opening 305 on the first side 210. Some embodimentsof the IC 200 can include metal lines 440 and interlayer dielectriclayers 450 on the first side 210 of the substrate 205. In some cases, atleast one of the metal lines 440 electrically connects a passive oractive electrical component 420 located on the first side 210 of thesubstrate 205 to an electrically conductive layer 430 covering the TSV820.

In some embodiments, a width 330 of the opening 302 of the STI structure810 is less than a width 320 of the opening 305 of the TSV 820.

The TSV opening 305 traverses the entire thickness 615 of the substrate205 while the STI opening 302 is buried in the substrate 205. In someembodiments, the TSI opening 302 can traverse a constituent layer 220present in some embodiments of the substrate 205.

In some embodiments of the IC 200, it is desirable for the width 330 ofthe STI structure 810 to be as narrow as possible to facilitateelectrical isolation of larger numbers of active or passive electricalcomponents 420 on the substrate 205. Having a narrow width 330facilitates having more area of the substrate 205 available to holdgreater numbers of the active or passive electrical components 420 orTSVs 820.

The width 320 of the TSV opening 305 is a careful balance of configuringthe TSV 820 to be wide enough to minimize electrical resistance of acurrent passing through the TSV 820, versus configuring the width 320too large as to occupy an excessive area of the substrate surface 817.Too high an electrical resistance could detrimentally slow the rate ofcommunicating electrical signals through the TSV 820. If the TSV 820were to occupy too much area on the substrate 205, this couldnecessitate, e.g., making a substrate die 205 larger to fit therequisite number of passive or active components needed for a specificapplication, thereby requiring more resources to manufactured thesubstrate 205 and thus making the IC 200 larger than desired.

As further illustrated in FIG. 8, in some embodiments, the substrate 205of the IC 200 is interconnected to one or more other substrates 830 bythe TSV 820. In some embodiments, the substrate 205 and the one moreother substrates 830 are part of a three-dimensional IC package 840. Forinstance, in some IC packages 840, the first side 210 of the substrate205 (e.g., the side 210 having active or passive components 420, 425thereon) can face the first side 845 of the other substrate 830. Inother embodiments, however, the front side 210 of the substrate 205 canface the second opposite side 850 of the other substrate 830. In someembodiments of the IC package 840 could include a stack 860 of multiplesubstrates 205, 830 that are interconnected to adjacent substrate, or,to non-adjacent substrates of the stack 840 by the TSV 820. Forinstance, a first substrate could be interconnected to a third substratethrough the TSV passing through a second substrate that is located inbetween the first and third substrate.

FIGS. 1-8 illustrate yet another integrated circuit embodiment of thedisclosure. Similar to that discussed above, the example IC 200 depictedin FIG. 8 comprises a substrate 205 having a first side 210 and a secondopposite side 215; a STI structure 810, wherein one end 812 of the STIstructure is buried inside the substrate 205 and an opposite end 815 ofthe STI structure 810 is located at a surface 817 of the first side 210of the substrate 205; and a TSV 820, wherein one end 822 of the TSV 820is located at the surface 817 of the first side 210 of the substrate 205and an opposite end 825 of the TSV 820 is located at the surface 306 ofthe second side 215 of the substrate 205.

For such embodiments of the IC 200, the STI structure 810 and the TSV820 are formed by a process that includes: forming the STI opening 302in the first side 210 of the substrate 205 (step 110), forming thepartial TSV opening 304 in the first side 210 of the substrate 205 (step115); extending the partial TSV opening 304 (step 117), wherein theextended partial TSV opening 305 is deeper into the substrate 205 thanthe STI opening 302; filling the STI opening 302 with a first solidmaterial 307 (step 120); and filling the extended partial TSV 305 with asecond solid fill material 310 (step 125.

Neither the STI opening 302, the partial TSV opening 304, nor theextended partial through-substrate via opening 305 penetrate an outersurface 306 of the second side 215 of the substrate 205. At leasteither: (1) the STI opening 302 and the partial TSV opening 304 areformed simultaneously (step 130), or, (2) the STI opening 302 and theextended partial TSV opening 305 are filled simultaneously (step 135).The IC 200 can further include additional features such as discussedabove in the context of FIGS. 1-8.

Those skilled in the art to which this application relates willappreciate that other and further additions, deletions, substitutionsand modifications may be made to the described embodiments.

What is claimed is:
 1. A method of manufacturing an integrated circuit,comprising: providing a substrate having a first side and a secondopposite side; forming a shallow trench isolation opening in the firstside of the substrate; forming a partial through-substrate via openingin the first side of the substrate; extending the partialthrough-substrate-via opening, wherein the extended partialthrough-substrate-via opening is deeper into the substrate than theshallow trench isolation opening; filling the shallow trench isolationopening with a first solid material; and filling the extended partialthrough-substrate via opening with a second solid material, wherein:neither the shallow trench isolation opening, the partialthrough-substrate-via opening, nor the extended partialthrough-substrate via penetrate an outer surface of the second side ofthe substrate, and at least either: the shallow trench isolation openingand the partial through-substrate-via opening are formed simultaneously,or, the shallow trench isolation opening and the extended partialthrough-substrate-via opening are filled simultaneously.
 2. The methodof claim 1, wherein, when the shallow trench isolation opening and theextended partial through-substrate via opening are simultaneouslyfilled, and then the shallow trench isolation opening is filled from thefirst side of the substrate with the first solid material that includesan insulating material, and, the extended partial through-substrate viaopening is filled from the first side of the substrate with the secondsolid material that includes an electrically conductive material.
 3. Themethod of claim 1, wherein the shallow trench isolation opening and thepartial through-substrate via opening are simultaneously formed, andthen, the shallow trench isolation opening and the extended partialthrough-substrate via opening are simultaneously filled from the firstside of the substrate, wherein the first solid material and the secondsolid material are a same material.
 4. The method of claim 3, whereinthe extended partial via opening and the shallow trench isolationopening are both filled with the same material that includes: apassivation layer of silicon oxide that coats interior walls of each ofthe extended partial through-substrate via opening and the shallowtrench isolation opening, a diffusion barrier layer of silicon nitrideon the passivation layer, and, an insulating plug of dielectric materialcontacting the diffusion barrier layer and substantially filling theentire depth of the extended partial through-substrate via opening andof the shallow trench isolation opening.
 5. The method of claim 1,further including forming at least one active or passive electroniccomponent on the first side of the substrate, wherein the active orpassive electronic component is electrically isolated from an adjacentactive or passive electronic component on the first side of thesubstrate by the shallow trench isolation opening located between theactive or passive electronic component and the adjacent active orpassive electronic component.
 6. The method of claim 1, furtherincluding forming at least one active or passive electronic component onthe first side of the substrate, wherein the active or passiveelectronic component is electrically isolated from an adjacent extendedpartial through-substrate via opening by the shallow trench isolationopening located between the active or passive electronic component andthe adjacent extended partial through-substrate via opening.
 7. Themethod of claim 1, further including covering the extended partialthrough-substrate via opening on the first side with an electricallyconductive layer.
 8. The method of claim 1, further including removing aportion of the second side of the substrate such that the extendedpartial through-substrate via opening is exposed on the second side. 9.The method of claim 1, further including removing at least a portion ofthe second solid material inside of the extended partialthrough-substrate via opening from the second side of the substrate suchthat a second-side through-substrate via opening extends from the secondside to the first side of the substrate.
 10. The method of claim 9,wherein removing the second solid material exposes an interior surfaceof an electrically conductive layer covering the second-sidethrough-substrate via opening on the first side.
 11. The method of claim10, further including filling the second-side through-substrate viaopening with an electrically conductive material.
 12. A method ofmanufacturing an integrated circuit, comprising: providing a substratehaving a first side and a second opposite side; forming a shallow trenchisolation opening in the first side of the substrate; forming a partialthrough-substrate via opening in the first side of the substrate,wherein the opening defining the shallow trench isolation structure andthe opening defining the through-substrate via have a substantially samewidth-to-depth aspect ratio; extending the partial through-substrate-viaopening, wherein the extended partial through-substrate-via opening isdeeper into the substrate than the shallow trench isolation opening;filling the shallow trench isolation opening with a first solidmaterial; and filling the extended partial through-substrate via openingwith a second solid material, wherein: neither the shallow trenchisolation opening, the partial through-substrate-via opening, nor theextended partial through-substrate via penetrate an outer surface of thesecond side of the substrate, and at least either: the shallow trenchisolation opening and the partial through-substrate-via opening areformed simultaneously, or, the shallow trench isolation opening and theextended partial through-substrate-via opening are filledsimultaneously.
 13. The method of claim 12, wherein, when the shallowtrench isolation opening and the extended partial through-substrate viaopening are simultaneously filled, and then the shallow trench isolationopening is filled from the first side of the substrate with the firstsolid material that includes an insulating material, wherein one end ofthe first material is buried inside the substrate and an opposite end ofthe first material is located at a surface of the first side of thesubstrate, and, the extended partial through-substrate via opening isfilled from the first side of the substrate with the second solidmaterial that includes an electrically conductive material.
 14. Themethod of claim 12, wherein the shallow trench isolation opening and thepartial through-substrate via opening are simultaneously formed, andthen, the shallow trench isolation opening and the extended partialthrough-substrate via opening are simultaneously filled from the firstside of the substrate, wherein the first solid material and the secondsolid material are a same material.
 15. The method of claim 14, whereinthe extended partial via opening and the shallow trench isolationopening are both filled with the same material that includes: apassivation layer of silicon oxide that coats interior walls of each ofthe extended partial through-substrate via opening and the shallowtrench isolation opening, a diffusion barrier layer of silicon nitrideon the passivation layer, and, an insulating plug of dielectric materialcontacting the diffusion barrier layer and substantially filling theentire depth of the extended partial through-substrate via opening andof the shallow trench isolation opening.
 16. The method of claim 1,further including forming at least one active or passive electroniccomponent on the first side of the substrate, wherein the active orpassive electronic component is electrically isolated from an adjacentactive or passive electronic component on the first side of thesubstrate by the shallow trench isolation opening located between theactive or passive electronic component and the adjacent active orpassive electronic component.
 17. The method of claim 1, furtherincluding forming at least one active or passive electronic component onthe first side of the substrate, wherein the active or passiveelectronic component is electrically isolated from an adjacent extendedpartial through-substrate via opening by the shallow trench isolationopening located between the active or passive electronic component andthe adjacent extended partial through-substrate via opening.
 18. Themethod of claim 1, further including covering the extended partialthrough-substrate via opening on the first side with an electricallyconductive layer.
 19. The method of claim 1, further including: removinga portion of the second side of the substrate such that the extendedpartial through-substrate via opening is exposed on the second side; andremoving at least a portion of the second solid material inside of theextended partial through-substrate via opening from the second side ofthe substrate such that a second-side through-substrate via openingextends from the second side to the first side of the substrate.
 20. Amethod of manufacturing an integrated circuit, comprising: providing asubstrate having a first side and a second opposite side; forming ashallow trench isolation opening in the first side of the substrate;forming a partial through-substrate via opening in the first side of thesubstrate; extending the partial through-substrate-via opening, whereinthe extended partial through-substrate-via opening is deeper into thesubstrate than the shallow trench isolation opening; filling the shallowtrench isolation opening with a first solid material wherein one end ofthe first material is buried inside the substrate and an opposite end ofthe first material is located at a surface of the first side of thesubstrate, and, the first sold material includes a passivation layer anda diffusion barrier layer on sidewalls of the opening defining theshallow trench isolation structure and on sidewalls of the openingdefining the through-substrate via; and filling the extended partialthrough-substrate via opening with a second solid material, wherein:neither the shallow trench isolation opening, the partialthrough-substrate-via opening, nor the extended partialthrough-substrate via penetrate an outer surface of the second side ofthe substrate, and at least either: the shallow trench isolation openingand the partial through-substrate-via opening are formed simultaneously,or, the shallow trench isolation opening and the extended partialthrough-substrate-via opening are filled simultaneously.